Skip to content

Home

  • Stamping & Press Automation

Travelling Die Clamps - ETDC

EAS Mold & Die Change Systems Inc • D40806
Travelling Die Clamps - ETDC

Travelling Die Clamps - ETDC

EAS Change Systems launches ETDC Travelling Die Clamps—an advanced automated clamping solution for large stamping presses. Combining electric travel with hydraulic clamping, ETDC enables fast, safe die changes with minimal manual intervention. Integrated sensors ensure precise, secure positioning. Designed for DIN 650 T-slots and 40–100 kN clamps, ETDC enhances safety, reduces setup time, and is ideal for non-standard dies, boosting uptime.

Popular Searches

Search results for ''

Page